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 IRFD120
Data Sheet July 1999 File Number
2315.3
1.3A, 100V, 0.300 Ohm, N-Channel Power MOSFET
This advanced power MOSFET is designed, tested, and guaranteed to withstand a specified level of energy in the breakdown avalanche mode of operation. These are N-Channel enhancement mode silicon gate power field effect transistors designed for applications such as switching regulators, switching convertors, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. They can be operated directly from integrated circuits. Formerly developmental type TA17401.
Features
* 1.3A, 100V * rDS(ON) = 0.300 * Single Pulse Avalanche Energy Rated * SOA is Power Dissipation Limited * Nanosecond Switching Speeds * Linear Transfer Characteristics * High Input Impedance * Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
Ordering Information
PART NUMBER IRFD120 PACKAGE HEXDIP BRAND IRFD120
Symbol
D
NOTE: When ordering, use the entire part number.
G
S
Packaging
HEXDIP
DRAIN GATE SOURCE
4-275
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
IRFD120
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified IRFD120 100 100 1.3 5.2 20 1.0 0.008 36 -55 to 150 300 260 UNITS V V A A V W W/oC mJ oC
oC oC
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Linear Derating Factor (See Figure 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Pulse Avalanche Energy Rating (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 125oC.
Electrical Specifications
PARAMETER Drain to Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current
TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS ID(ON) IGSS rDS(ON) gfs td(ON) tr td(OFF) tf Qg(TOT) Qgs Qgd CISS COSS CRSS LD Modified MOSFET Symbol Showing the Internal Device's Measured From the Source Inductances D Lead, 2mm (0.08in) from Header to Source Bonding LD Pad
G LS S
TEST CONDITIONS ID = 250A, VGS = 0V (Figure 9) VGS = VDS, ID = 250A VDS = Rated BVDSS, VGS = 0V VDS = 0.8 x Rated BVDSS, VGS = 0V, TJ = 125oC VDS > ID(ON) x rDS(ON) Max, VGS = 10V VGS = 20V ID = 0.6A, VGS = 10V (Figures 7, 8) VDS > ID(ON) x rDS(ON)MAX , ID = 0.6A (Figure 11) VDD = 0.5 x Rated BVDSS, ID 1.3A, VGS = 10V, RG = 9.1 RL = 38.5 for VDD = 50V MOSFET Switching Times are Essentially Independent of Operating Temperature VGS = 10V, ID = 1.3A, VDS = 0.8 x Rated BVDSS, Ig(REF) = 1.5mA (Figure 13) Gate Charge is Essentially Independent of Operating Temperature VGS = 0V, VDS = 25V, f = 1MHz (Figure 10)
MIN 100 2.0 1.3 0.9 -
TYP 0.25 1.0 20 35 50 35 11 6.0 5.0 450 200 50 4.0
MAX 4.0 25 250 500 0.30 40 70 100 70 15 -
UNITS V V A A A nA S ns ns ns ns nC nC nC pF pF pF nH
On-State Drain Current (Note 2) Gate Source Leakage Drain Source On Resistance (Note 2) Forward Transconductance (Note 2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge (Gate to Source + Gate to Drain) Gate to Source Charge Gate to Drain "Miller" Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Internal Drain Inductance
Measured From the Drain Lead, 2mm (0.08in) from Package to Center of Die
-
Internal Source Inductance
LS
-
6.0
-
nH
Thermal Resistance Junction to Ambient
RJA
Free Air Operation
-
-
120
oC/W
4-276
IRFD120
Source to Drain Diode Specifications
PARAMETER Continuous Source to Drain Current Pulse Source to Drain Current SYMBOL ISD ISDM TEST CONDITIONS Modified MOSFET Symbol Showing the Integral Reverse P-N Junction Diode
G D
MIN -
TYP -
MAX 1.3 5.2
UNITS A A
S
Source to Drain Diode Voltage (Note 2) Reverse Recovery Time Reverse Recovery Charge NOTES:
VSD trr QRR
TJ = 25oC, ISD = 1.3A, VGS = 0V (Figure 12) TJ = 150oC, ISD = 1.3A, dISD/dt = 100A/s TJ = 150oC, ISD = 1.3A, dISD/dt = 100A/s
-
280 1.6
2.5 -
V ns C
2. Pulse test: pulse width 300s, duty cycle 2%. 3. VDD = 25V, starting TJ = 25oC, L = 32mH, RG = 25, peak IAS = 1.3A.
Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8
Unless Otherwise Specified
1.5
ID, DRAIN CURRENT (A) 0 25 125 50 75 100 TA , AMBIENT TEMPERATURE (oC) 150
1.2
0.9
0.6 0.4
0.6
0.2 0
0.3
0 25 50 75 100 125 150 TA , AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs AMBIENT TEMPERATURE
10
20 VGS = 10V PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 9V VGS = 8V 12 VGS = 7V 8 VGS = 6V 4 VGS = 5V VGS = 4V 0 100 0 10 20 30 40 VDS, DRAIN TO SOURCE VOLTAGE (V) 50
ID, DRAIN CURRENT (A)
1
100s 1ms 10ms
0.1
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON)
100ms
0.01
TJ = MAX RATED 1 10 VDS , DRAIN TO SOURCE VOLTAGE (V)
DC
0.1
FIGURE 3. FORWARD BIAS SAFE OPERATING AREA
ID, DRAIN CURRENT (A)
16
FIGURE 4. OUTPUT CHARACTERISTICS
4-277
IRFD120 Typical Performance Curves
10 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V VGS = 9V 6 VGS = 6V
Unless Otherwise Specified (Continued)
IDS(ON), DRAIN TO SOURCE CURRENT (A) 20
VGS = 8V VGS = 7V
ID, DRAIN CURRENT (A)
8
16
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDS > ID(ON) x rDS(ON)MAX
12
TJ = -55oC oC TJ = 25 TJ = 125oC
4 VGS = 5V 2 VGS = 4V 0 0 1 2 3 4 VDS, DRAIN TO SOURCE VOLTAGE (V) 5
8
4
0
0
2
4
6
8
10
VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 5. SATURATION CHARACTERISTICS
FIGURE 6. TRANSFER CHARACTERISTICS
0.8 2s PULSE TEST NORMALIZED DRAIN TO SOURCE ON RESISTANCE rDS(ON), DRAIN TO SOURCE ON RESISTANCE ()
2.2
0.6
VGS = 10V
1.8
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 0.6A
1.4
0.4
1.0
0.2
VGS = 20V
0.6
0
0.2 0 10 20 30 ID, DRAIN CURRENT (A) 40 -40 0 40 80 120 160 TJ , JUNCTION TEMPERATURE (oC)
NOTE:
Heating effect of 2s pulse is minimal. FIGURE 8. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 7. DRAIN TO SOURCE ON RESISTANCE vs GATE VOLTAGE AND DRAIN CURRENT
1.25 IDS = 250A NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE 1.15 C, CAPACITANCE (pF)
1000 VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGD
800
1.05
600 CISS 400 COSS CRSS
0.95
0.85
200
0.75 -40
0
40
80
120
160
0
0
10
TJ , JUNCTION TEMPERATURE (oC)
40 30 20 VDS, DRAIN TO SOURCE VOLTAGE (V)
50
FIGURE 9. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 10. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
4-278
IRFD120 Typical Performance Curves
5 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
Unless Otherwise Specified (Continued)
2 ISD, SOURCE TO DRAIN CURRENT (A)
TJ = -55oC TJ = 25oC TJ = 125oC
PULSE DURATION = 80s
gfs, TRANSCONDUCTANCE (S)
DUTY CYCLE = 0.5% MAX 102 5 2 10 5 2 0.1 TJ = 150oC TJ = 25oC
4
3
2
1
0 0 4 8 12 ID , DRAIN CURRENT (A) 16 20
0
2 3 1 VSD, SOURCE TO DRAIN VOLTAGE (V)
4
FIGURE 11. TRANSCONDUCTANCE vs DRAIN CURRENT
FIGURE 12. SOURCE TO DRAIN DIODE VOLTAGE
20 ID = 5.2A VGS, GATE TO SOURCE (V) VDS = 20V VDS = 50V VDS = 80V 10
15
5
0 0 2 4 6 QG, GATE CHARGE (nC) 8 10
FIGURE 13. GATE TO SOURCE VOLTAGE vs GATE CHARGE
Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
-
0V
IAS 0.01
0 tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
4-279
IRFD120 Test Circuits and Waveforms
(Continued)
tON td(ON) tr RL VDS
+
tOFF td(OFF) tf 90%
90%
RG DUT
-
VDD 0
10% 90%
10%
VGS VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 16. SWITCHING TIME TEST CIRCUIT
VDS (ISOLATED SUPPLY)
FIGURE 17. RESISTIVE SWITCHING WAVEFORMS
CURRENT REGULATOR
VDD SAME TYPE AS DUT Qg(TOT) Qgd Qgs D VDS VGS
12V BATTERY
0.2F
50k 0.3F
G
DUT 0
Ig(REF) 0 IG CURRENT SAMPLING RESISTOR
S VDS ID CURRENT SAMPLING RESISTOR Ig(REF) 0
FIGURE 18. GATE CHARGE TEST CIRCUIT
FIGURE 19. GATE CHARGE WAVEFORMS
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
4-280


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